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HEAT SINK DESIGN FOR OPTIMAL PERFORMANCE OF COMPACT ELECTRONIC APPLIANCES - A REVIEW
1Nilesh Khamkar, 1Avinash Waghmode, 1Atul Joshi, 1Pramod Supekar 2Dr. Ashwini Kumar, 3Prof. Kiran Londhe, 4Prof. Vipul R. Kaushik

Published in: Journal for Advance Research in Applied Sciences
Volume- 4, Issue-5, pp.13-21, Oct 2017
DPI :-> 16.10089.JARAS.2017.V4I5.1321.1994



Abstract
The ever rising transistor densities and switching speeds in microprocessors have been accompanied a dramatic increase in the system heat flux and power dissipation. In this context the rising IC densities combined with even more stringent performance and reliability requirement have made thermal management issues ever more prominent in the design of sophisticated microelectronic systems. So in order to achieve a high degree power dissipation extruded heat sinks, a number of research works have been done in last two decades. It is observed that components of modern portable electronic devices with increasing heat loads with decrease in the space available for heat dissipation. The increasing heat load of the device needs to be removed for maintaining the efficient performance of the device. The exponential increase in thermal load in air cooling devices requires the thermal management system to be optimized to attain the highest performance in the given space. In the present paper a review report on comprehensive description for thermal conditions for cooling purpose within the heat sink for electronic devices has been summarized

Key-Words / Index Term
Heat sink, CFD, Heat transfer, Cooling system, Heat pipe

How to cite this article
1Nilesh Khamkar, 1Avinash Waghmode, 1Atul Joshi, 1Pramod Supekar 2Dr. Ashwini Kumar, 3Prof. Kiran Londhe, 4Prof. Vipul R. Kaushik , “HEAT SINK DESIGN FOR OPTIMAL PERFORMANCE OF COMPACT ELECTRONIC APPLIANCES - A REVIEW”, Journal for Advance Research in Applied Sciences, 4, Issue-5, pp.13-21, Oct 2017. DPI:16.10089.JARAS.V4.I5.1994